Link Fab Technologies is proud to partner with the various renowned companies each specialised in their field of technical expertise.

Our collaboration aims to bring solutions to your doorsteps.

EV Group (EVG) targets advanced packaging, compound semiconductor and silicon-based power devices, MEMS, nanotechnology and SOI markets with its industry-leading wafer-bonding, lithography/nanoimprint lithography(NIL), metrology, photoresist coating, cleaning and inspection equipment.

EV Group holds the dominant share of the market for wafer bonding equipment (especially SOI bonding) and is a leader in lithography for advanced packaging and nanotechnology.

SENTECH Instruments develops, manufactures, and sells worldwide advanced quality instrumentation for Plasma Etching, PECVD, Atomic Layer Deposition, Thin Film Measurement (Spectroscopic Ellipsometry, Spectroscopic Reflectometry and Laser Ellipsometer) and Photovoltaics.

3D-Micromac is the leading specialist in laser micromachining. The team of experts develop processes, machinery and complete systems at the highest technical and technological level.

Since placing great importance on continually expanding their know-how, 3D Micromac is diligent about keeping up with the latest research. On a daily basis, 3D Micromac combine recent results with customers’ demands to realize them in practice.

Diener Electronic is an innovative company in the field of plasma technology and an international leader in the production of low-pressure plasma systems, plasma HF generators and atmospheric plasma. Their technological maturity and resounding success guarantee continuous, global expansion.

Till date, there are already more than 10,000 Diener Plasma systems worldwide!

Guyson International Limited is a privately owned family company with a world-wide reputation for excellence in the design and manufacture of blast finishing, spray wash and ultrasonic cleaning equipment.